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2.54mm Pitch 3P Single Row Black Right Angle Tin-Plated Wire to Board Wafer Connector

Consulting price

Parameter introduction:



3、接触电阻:10mΩ Max

4、绝缘电阻:1000MΩ Min1. Current: 1A-12A

2. Voltage: 250V

3. Contact Resistance: 10 mΩ Max

4. Insulation Resistance: 1,000 MΩ Min

5. Operating Temperature: -25℃± 85℃

Material Quality:

1. Contact Material: Copper, Phosphorus Bronze

2. Electroplating Method: Tin Plating

3. Insulation Material: LCP, UL94V-0, Nylon 66 (available in black, white, beige, transparent color, custom color)

All products meet ROHS 2.0, REACH, UL certification, export quality requirements.

5、工作温度:-25℃± 85℃




3、绝缘材质:UL94V-0 尼龙66 ( 有黑色,白色,米色 、透明色、定制颜色)

所有产品均符合ROHS 2.0REACH ,UL认证,出口品质要求

Product introduction

13 years experience connector manufacturer, covers board to board connector,wire to board connector, wire harness, finished wire and cables , plastic, hardware mold production, 70% of the product export.

Our company can provide 1.0mm, 1.25mm, 1.50mm, 1.58mm, 2.0mm, 2.50mm, 2.54mm, 3.0mm, 3.50mm, 3.68mm, 3.96mm, 4.20mm, 4.50mm, 5.08mm, 6.0mm, 6.20mm, 6.35mm, 7.62mm, 10.60mm etc pitch wire to board wafer connector products, customized 300,000 special connector products for domestic and foreign customers.

Our company has a strong research and development strength, 13 years of mold engineering research and development department, the delivery period is short, welcome new and old customers to consult ----- DongGuan J&L Electronic Technology Co.,LTD